MAX811TEUS+T

Product Summary

The MAX811TEUS+T is designed as one kind of low-power microprocessor (μP) supervisory circuit device that performs a single function - It asserts a reset signal whenever the VCC supply voltage falls below a preset threshold. And this device also provides a debounced manual reset input. Low supply current makes the MAX811T ideal for use in portable equipment. This device comes in a 4-pin SOT143 package.

Parametrics

Absolute maximum ratings:(1)Terminal Voltage (with respect to GND) VCC: -0.3 V to 6.0 V;(2)Terminal Voltage (with respect to GND) All Other Inputs: -0.3 V to (VCC + 0.3 V);(3)Input Current, VCC, MR: 20 mA;(4)Output Current, RESET or RESET: 20 mA;(5)Operating Temperature Range: -40°C to +85°C;(6)Storage Temperature Range: -65°C to +160°C;(7)Lead Temperature (soldering, 10sec): +300°C;(8)Continuous Power Dissipation (TA = +70°C) 4-Lead SOT143: 320 mW.

Features

Features:(1)Package Type: 4-Lead SOT143; (2)Lead Frame: Copper; (3)Lead Finish: Solder Plate; (4)Die Attach: Silver-filled Epoxy; (5)Bondwire: Gold (1.0 mil dia.); (6)Mold Material: Epoxy with silica filler; (7)Assembly Diagram: Buildsheet 05-1701-0263; (8)Flammability Rating: Class UL94-V0; (9)Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1; (10)Dimensions: 37 x 31 mils; (11)Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)Interconnect: Aluminum/ Copper/ Si; (12)Backside Metallization: None; (13)Minimum Metal Width: 1.2 microns (as drawn); (14)Minimum Metal Spacing: 1.2 microns (as drawn); (15)Bondpad Dimensions: 5 mil. Sq.; (16)Isolation Dielectric: SiO2; (17)Die Separation Method: Wafer Saw; (18)Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director of QA); (19)Kenneth Huening (Vice President); (20)Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet; (21)0.1% For all Visual Defects; (22)Observed Outgoing Defect Rate: < 50 ppm; (23)Sampling Plan: Mil-Std-105D.

Diagrams